发明名称 DIE BONDING ADHESIVE TAPE
摘要 PURPOSE:To obtain a die bonding adhesive tape of excellent adhesiveness, by combining a separator composed of a support and release layers provided thereon with an adhesive layer adhered to at least either of the release layers and having the exposed surface which is a specular surface. CONSTITUTION:This die bonding adhesive tape is composed of a separator composed of a support and release layer(s) provided on at least one surface and an adhesive layer adhered to at least either of the release layers, wherein the exposed surface of the adhesive layer is a specular surface having a centerline average roughness <=2.5mum and a max. height <=20mum. The surface of a die bonding adhesive tape can be brought to a state of a specular surface by passing a usual adhesive tape provided with a separator through a heating roll at 80-140 deg.C. The structure of the layers of the die bonding adhesive tape is such that when the support is fed in the form of a sheet, the separator is formed by providing a release layer on either surface of the support, and when the support is fed in the form of a roll, the separator needs to be formed by providing release layers on both surfaces of the support.
申请公布号 JPH01299884(A) 申请公布日期 1989.12.04
申请号 JP19880131077 申请日期 1988.05.28
申请人 TOMOEGAWA PAPER CO LTD 发明人 SAKUMOTO YUKINORI;KOSHIMURA ATSUSHI;TSUSHIMA MASAKI
分类号 C09J7/02;H01L21/58 主分类号 C09J7/02
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