| 摘要 |
<p>PURPOSE:To prevent cut grains from sticking to the surface of a semiconductor wafer by covering the surface with a water film at the time of dicing the semiconductor wafer. CONSTITUTION:On semiconductor-substrate support pedestal 12, wafer 13 is held by decompressing-suction via decompression openings 14 and 14' and diced along its dicing line by rotary blade 11 rotating at a speed of more 10000 r.p.m. At this time, a water film is formed over wafer 13 by water pipe 15 and cut grains made during the dicing are washed away. On the other hand, water is supplied to blade 11 via water pipe 25 to wash away cut grains sticking the surface of the blade and the scattering speed of cut grains is reduced to form water film 26 for the prevention of scattering. In this way, water films 16 and 26 are renewed constantly and cut grains are discharged. Consequently, the wafer surface is covered with a water film, so that cut grains will be prevented from sticking to the surface of the wafer.</p> |
