发明名称 HOT MELT ADHESIVE FOAM BONDING PROCESS AND APPARATUS
摘要 The solid adhesive is placed in a tank (15) in which it melts to form a reserve of melt. The latter descends the walls (34, 35) of the tank towards the inlet (20) of a pump (16). A gas is transmitted at a pressure slightly above atmospheric pressure by a conduit (21) towards the air inlet. The liquid and the gas which enter simultaneously are mixed in the pump (16) and expelled under pressure into a conduit (22). The solution formed then passes through a filter (18), conduits (23) and a pipe (25) towards a dispenser gun at the outlet of which the solution forms a foam containing minuscule gas bubbles in the liquid. The bubbles grow and multiply when the stream moves away from the nozzle. Even after deposition on a substrate the beads continue to grow. This foam retains adhesiveness characteristics which are superior to those of the same adhesive when dispensed under the same conditions but without bubbles in the liquid. <IMAGE>
申请公布号 AU2723677(A) 申请公布日期 1979.01.25
申请号 AU19770027236 申请日期 1977.07.22
申请人 NORDSON CORP. 发明人 CHARLES H. SCHOLL;JOHN R. JANNER, JR.;WILLIAM C. STUMPHAUZER;DUANE O. SHUSTER
分类号 B05C5/04;B27G11/00;B29C55/00;B29C65/00;B29C65/40;B29C65/48;B29C65/52;B31B1/62;C08J9/04;C09J5/00;C09J5/06;C09J5/08;C09J11/06;C09J201/00;H01F5/06 主分类号 B05C5/04
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