CERAMIC PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a ceramic package capable of conduction of the conductor layer of a sealed surface and an internal connection terminal and an electronic component mounting part inside a cavity even when the seal path width for a seal ring is small. SOLUTION: Conductor wiring 24 in continuity with the seal ring 13 is formed on the side wall surface 23 of the cavity 22 by castration. Also, the conductor wiring 24 is in the conductive state through a wiring pattern with a part of the internal connection terminal 12 formed inside the cavity 22 and a brazing filler metal flow blocking part 26 is provided on the wiring pattern so as not to expose a conductor to the surface of an insulation body.