BRIGHT SOLDER PLATING

摘要

Disclosed is a method and composition for electroplating a layer of bright solder on a base metal. In addition to soluble divalent tin and lead salts, the bath contains formaldehyde, an aryl primary amine, a condensation product of an aromatic aldehyde and an aromatic amine and a polynuclear aromatic disulfonic acid. Deposits obtained by this bath are not only mirror bright, but exhibit no haze. An important advantage is that the solderability of the deposit may be correlated to its physical appearance.