PHENOL-FORMALDEHYDE RESINS AND ADHESIVES

摘要

1496703 Phenol-formaldehyde resins and adhesives WEYERHAEUSER CO 11 March 1975 [11 March 1974] 10113/75 Heading C3R A liquid water dilutable resin composition is prepared by subjecting to reaction conditions in an aqueous solution and until substantially all the free formaldehyde is consumed (i) a phenol-formaldehyde reaction product comprised principally, i.e. at leat 50% wt., of monomeric methylolphenols, (ii) free formaldehyde supplied as such or in the form of a formaldehyde donor, and (iii) resorcinol and/or phloroglucinol in which the molar quantities of free formaldehyde, Ff resorcinol and/or phloroglucinol, R, combined formaldehyde, F c , and phenol, P, satisfy the equation wherein F c #0À9P, F f #0À35P and the reaction temperature preferably being from 60‹ C. to reflux. Up to 10% of the phenol may be replaced by m-cresol and up to 10% of the resorcinol and/or phloroglucinol may be replaced by catechol and/or hydroquinone. The methylolphenols are preferably prepared by reacting HCHO and phenol in an aqueous alkaline solution at a temperature of 20-85‹ C. at a pH below 10 generally in the presence of an alkaline catalyst. The liquid resin obtained can be used as such in the preparation of adhesives or when it has been further polymerized by increasing the alkalinity and/or continuing the cooking preferably for a time such that the composition at a pH of 7.5 and a solids content of 54% wt. exhibits a Gardner viscosity of from S to U at 25‹ C. The adhesives comprise a liquid or powdered hardener preferably an alkylene group donor, e.g. HCHO or a polymer thereof, which reacts with the resin to form an insoluble infusible product. A preferred powdered hardener comprises paraformaldehyde and an inert filler, e.g. walnut shell flour, clays or wood flour. The adhesive may also comprise modifiers for controlling viscosity and thixotropy, e.g. pyrogenic silica or asbestos. The adhesives have a high electrical conductivity, e.g. greater than 1000 Ámho/cm. and are useful as wood adhesives. The rate of curing can be controlled by adjusting the pH. In Examples 1-4 a liquid resin prepared by reacting resorcinol with an aqueous methanolic solution of methylolphenols and free HCHO is further polymerized by heating in the presence of aqueous ethanolic NaOH. The resin obtained is mixed with either a powdered hardener comprising walnut shell flour, paraformaldehyde powder and an attapulgite clay or with a liquid hardener comprising ethanolic paraformaldehyde, walnut shell flour, attapulgite clay and a pyrogenic silica, and is used to bond wood. The adhesive is cured either at room temperature or by heating or by using radio frequency.