Printed circuit board soft solder connections - have indentation made in material wound with thin copper wire to form wiped joint

摘要

Soft or tin solder connections are formed on a material, such as e.g. high-grade steel, titanium, ceramic or similar, that is difficult to solder with tin solder. The method is suitable for soldering very small components in the electronics industry, such as an printed circuit boards. Initially, an indentation, or insertion or a constriction is made on the wire, bar or strip material, at least partly around the periphery of the wire, to form a sharp edge in the region of the material provided for the tin solder connections. Next, thin copper wire is wound tightly around the material in the region of the indentation, insertion, construction etc. the wires dia. being small in comparison to the width of the interlation, insertion etc. When several turns of wire have been completed, the region wound with wire is tinned with the solder (5).