| 摘要 |
<p>1444179 Plating aluminium-containing surfaces with metals BORG WARNER CORP 2 Nov 1973 [7 Nov 1972] 51043/73 Headings C7B and C7F [Also in Division B3] An Al or Al alloy surface is plated electrolytically or electrolessly with Ni-X, Co-X or Ni-Co- X, where X is Pb or Bi, from an aqueous bath containing a Ni and/or Co salt, a buffering salt and 0À005-1À0 wt. per cent of a Pb or Bi salt, the bath pH being maintained at 7-12 e.g. by addition of an alkali metal or ammonium hydroxide. The plating is stated to comprise finely-divided spongelike particles usually of diameter # 100Á inches. Electrolytic baths may contain the sulphates and chlorides of Ni and/or Co; Na citrate or gluconate as buffer; and Pb acetate or citrate or Bi lactate. Electroless baths are similar but contain no chloride. The use of a hypophosphite bath is mentioned for Ni plating. The bath may be at 80-200‹F. The plating is useful as a bond-forming agent in brazing and soldering, and the Al surface plated may comprise a brazing alloy, e.g. Al-Si.</p> |
