| 摘要 |
Insulating layer is formed on the metal support from a solid material in the powder or paste form and consolidated by a thermal process. Suitable insulating materials include glasses, enamels, ceramic oxides, or cpds. contg. the same. Effective removal of heat is ensured. The process is suitable for the prodn. of multi-chip devices complex, hybrid devices; systems having a purely passive network, etc. |
