| 发明名称 | Carrier board for attachment of integrated circuit to circuit board | ||
| 摘要 | An electronics system includes a main circuit board; main circuitry located on the main circuit board; a carrier board located on top of the main circuit board; an integrated circuit (IC) located on the carrier board, wherein the IC is electrically connected to the main circuitry on the main circuit board; and a layer of adhesive located between the carrier board and the main circuit board. | ||
| 申请公布号 | US9380703(B2) | 申请公布日期 | 2016.06.28 |
| 申请号 | US201313771239 | 申请日期 | 2013.02.20 |
| 申请人 | RAYTHEON COMPANY | 发明人 | Glidden, IV Robert M.;Johnson Clay;Mikasa Michael H. |
| 分类号 | H05K7/00;H05K1/14;H05K1/02;H05K3/00 | 主分类号 | H05K7/00 |
| 代理机构 | Cantor Colburn LLP | 代理人 | Cantor Colburn LLP |
| 主权项 | 1. An electronics system comprising: a main circuit board; main circuitry located on the main circuit board; a carrier board located on top of the main circuit board; an integrated circuit (IC), wherein a main portion of the IC is located adjacent to the carrier board, such that the main portion of the IC is not located on top of the carrier board, and wherein a lead of the IC is extends from the main portion of the IC over the carrier board such that the lead is located on top of the carrier board, wherein the lead of the IC on the carrier board is electrically connected to the main circuitry on the main circuit board via a bridging wire that extends from the carrier board to the main circuitry on the main circuit board; and a layer of adhesive located between the carrier board and the main circuit board. | ||
| 地址 | Waltham MA US | ||