| 发明名称 |
PRODUCTION OF CERAMIC PACKAGE SEAL TYPE SEMICONDUCTOR DEVICE |
| 摘要 |
PURPOSE:Pellets and wires are positively connected and a ceramic package seal type semiconductor device of high reliability is produced by directly applying gold plating on a high melting point metal conductor layer and depositing silver soldet. |
| 申请公布号 |
JPS5284972(A) |
申请公布日期 |
1977.07.14 |
| 申请号 |
JP19760000790 |
申请日期 |
1976.01.07 |
| 申请人 |
HITACHI LTD |
发明人 |
OOTSU MAMORU |
| 分类号 |
H01L23/12;H01L23/02;H01L23/04 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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