| 摘要 |
PURPOSE:To obtain a circuit board composed of divided boards which are connected to electronic components or to each other with flexible conductor wires by a method wherein parts of conductor patterns on the surface of a ceramic board are taken out and the flexible conductor wires are composed of the taken out conductor patterns, resin films and insulating films. CONSTITUTION:Ag.Pd conductor paste is applied to the surface of a ceramic board 10 and baked to form lower conductor patterns 18 and notches 12 are provided on the rear of the board. Cu paste is applied to the board surface to form thick conductor patterns 15. When the patterns 15 are baked, Ag in the patterns 18 is diffused into Cu and parts 18A with degraded adhesion strength are formed. Spaces 11 are provided by removing the parts of the board 10 between the notches 12 to divide the board. Polyimide films 16 are bonded to the lower surfaces of the patterns 15 with adhesive. Then the patterns 15 are covered with polyimide films 17. With this constitution, the impedance mismatch of a connection part between the boards or between the boards and electronic components can be reduced and highly reliable connection can be obtained. |
