| 发明名称 |
RESIN SHEET FOR SEALING ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC-DEVICE PACKAGE |
| 摘要 |
Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm. |
| 申请公布号 |
US2016269000(A1) |
申请公布日期 |
2016.09.15 |
| 申请号 |
US201415032105 |
申请日期 |
2014.10.03 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
Shimizu Yusaku;Toyoda Eiji;Shiga Goji |
| 分类号 |
H03H9/64;H03H3/08;H01L23/29;H01L21/56;H01L21/78 |
主分类号 |
H03H9/64 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device sealing resin sheet, having a probe tack of 5 g to 500 g at 25° C., the tack being measured, using a probe having a diameter of 25 mm. |
| 地址 |
Ibaraki-shi, Osaka JP |
