发明名称 |
APPARATUS FOR THERMAL PROCESSING OF RESIN SHEET |
摘要 |
<p>PURPOSE:To suppress deformation at most to four times the thickness of a base and to rapidly replace a resin sheet after thermal processing by arranging a cooler to the rear of a table for mounting the resin sheet and controlling the flow rate of a cooling medium to control the temp. of the table. CONSTITUTION:A cooling liquid 18 is cooled by a cooler 19 and the temp. in the vicinity of the resin sheet 1 of a table 3 is measured by a thermocouple 22 and the amount of the cooling liquid 18 is controlled by a cooling temp. controller 23 to hold the temp. of the table 3 to 0-5 deg.C. The resin sheet 1 is stationarily placed on the surface having groves 16 of a vacuum chuck plate 4 and a vacuum pump 5 is operated to attract the resin sheet 1 and a base 7 is cooled. The heater 10 is kept constant between the m.p. of the resin sheet 1 and the m.p. +50 deg.C by a temp. controller 11 and pressed to the projections 8 of the resin sheet 1 by a pressing device 12 and only the parts 8a of about 2/3 of the upper parts of the projections 8 are melted. Next, wires 9 are covered with the molten projections 8 and the molten projection 8 are cooled to fix the wires 9 and vacuum is released to atmospheric pressure to take out the resin sheet 1.</p> |
申请公布号 |
JPH03278938(A) |
申请公布日期 |
1991.12.10 |
申请号 |
JP19900081944 |
申请日期 |
1990.03.29 |
申请人 |
HITACHI METALS LTD |
发明人 |
MIKAMOTO TSUKASA;TOMIYAMA HIROSHI;OZAKI MASAMICHI |
分类号 |
B29C65/20;B29C35/16;B29C37/00;B29C43/52;B29C65/78;B29C70/82;B29D23/00;B29L7/00 |
主分类号 |
B29C65/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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