| 摘要 |
PURPOSE:To provide a semiconductor device capable of highly maintaining an insulating characteristic between an island and a chip by a method wherein an insulating characteristic film is interposed between the island and the chip. CONSTITUTION:An insulating characteristic film 6 whose one-side is coated with adhesive is fixed on an island 1 so as to make an adhesive layer surface upside-down. A semiconductor chip 3 is fixed on the film 6 by an insulating adhesive 2 containing no conductive material. Alternatively, an insulating characteristic film 7 having a one-sided adhesive layer is fixed on the island with the insulating adhesive 2. The chip 3 is fixed on the adhesive layer surface on the upper surface of the film 7. In addition, the chip 3 is fixed on the island 1 with an insulating characteristic film 8 of a both-sided adhesive. Alternatively, an insulating characteristic film 9 is fixed on the island with the insulating adhesive 2. The chip 3 is fixed on the film 9 with the insulating characteristic adhesive 2. |
