| 摘要 |
<p>PURPOSE:To reduce the number of components and the number of steps in a simple structure, to improve its yield and to reduce a manufacturing cost by directly securing a solid state image sensor chip on a light transmission board. CONSTITUTION:A conductor pattern 11 is formed on one main surface of a light transmission board 10 made of glass, etc., and a protruding electrode 12 is formed partly on the pattern 11. On the other hand, a solid state image sensor chip 20 having a bump electrode 21 at a photodetecting surface side is so disposed as to oppose the photodetecting surface to the surface of the board 10 formed with the pattern 11, the electrode 21 is connected to the electrode 12 to be fixed. A lead electrode 13 is connected to the pattern 11 of the board 10 by solder 14. Light transmission resin 15 is filled between the chip 20 and the board 10, and further molding resin 16 is provided to cover the main surface, the side of the board 10, and the chip 20.</p> |
