| 摘要 |
<p>In a process for forming field oxide regions (40) between active regions in a semiconductor substrate (10), pad oxide, polysilicon and first silicon nitride layers (12,14,16) are successively formed over substrate active regions. The first nitride layer (16), polysilicon layer (14), pad oxide layer (12) and a portion of the substrate (10) are then selectively etched to define field oxide regions with substantially vertical sidewalls (21). A second silicon nitride (32) is provided on the substantially vertical sidewalls (21), and field oxide (40) is grown in the field oxide regions. The first silicon nitride, polysilicon and pad oxide layers (16,14,12) are then removed. The employment of the polysilicon layer (14) prevents the exposure of corners (44) between the field oxide (40) and active regions if an overetch occurs during the removal of the pad oxide layer (12). <IMAGE></p> |
