发明名称 |
Curable resin, curable resin material, curable film, and insulator |
摘要 |
The present invention uses a curable resin which has: in the molecule thereof, at least two crosslinking functional groups of at least one kind selected from the group consisting of epoxy group, (meth)acryloyl group, alkenylamino group and alkenyloxy group; a glass transition temperature before curing of 50 to 150° C.; a weight-average molecular weight of 10,000 to 1,000,000; and a dielectric constant of not higher than 3.5 after curing. By use of the curable resin of the above constitution, the present invention can provide a curable resin that an insulator having an excellent thermal shock resistance and an excellent dielectric property is obtained.
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申请公布号 |
US7271219(B2) |
申请公布日期 |
2007.09.18 |
申请号 |
US20030466559 |
申请日期 |
2003.07.25 |
申请人 |
SANYO CHEMICAL INDUSTRIES, LTD. |
发明人 |
SAITO TAKAO;KON SHIGETO;SATAKE MUNEKAZU;INOUE MASAHITO |
分类号 |
C08L23/04;C08F283/00;C08F287/00;C08F290/04;C08F290/06;C08F290/14;C08G61/06;C08G65/48;C08J5/18;C08L25/14;C08L33/00;C08L33/06;C08L35/00;C08L35/06;C08L37/00;C08L41/00;C08L51/00;C08L53/02;C08L63/00;C08L101/02;H01L23/29;H01L23/498 |
主分类号 |
C08L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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