发明名称 Solder alloy, solder paste, and electronic circuit board
摘要 A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.
申请公布号 US9445508(B2) 申请公布日期 2016.09.13
申请号 US201314414453 申请日期 2013.06.25
申请人 HARIMA CHEMICALS, INCORPORATED 发明人 Nakanishi Kensuke;Inoue Kosuke;Ichikawa Kazuya;Shigesada Tetsuyuki;Takemoto Tadashi
分类号 C22C13/00;C22C13/02;B23K35/26;H05K3/34;B23K35/02;H05K1/09 主分类号 C22C13/00
代理机构 Buchanan, Ingersoll & Rooney PC 代理人 Buchanan, Ingersoll & Rooney PC
主权项 1. A tin-silver-copper solder alloy consisting of: tin, silver, copper, bismuth, nickel, and cobalt, wherein relative to the total amount of the solder alloy, the silver content is above 2 mass % and 4 mass % or less, the copper content is 0.1 mass % or more and 1 mass % or less, the bismuth content is 0.5 mass % or more and 4.8 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, the cobalt content is 0.001 mass % or more and 0.008 mass % or less, and the tin content is the remaining content.
地址 Hyogo JP