发明名称 |
Solder alloy, solder paste, and electronic circuit board |
摘要 |
A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less. |
申请公布号 |
US9445508(B2) |
申请公布日期 |
2016.09.13 |
申请号 |
US201314414453 |
申请日期 |
2013.06.25 |
申请人 |
HARIMA CHEMICALS, INCORPORATED |
发明人 |
Nakanishi Kensuke;Inoue Kosuke;Ichikawa Kazuya;Shigesada Tetsuyuki;Takemoto Tadashi |
分类号 |
C22C13/00;C22C13/02;B23K35/26;H05K3/34;B23K35/02;H05K1/09 |
主分类号 |
C22C13/00 |
代理机构 |
Buchanan, Ingersoll & Rooney PC |
代理人 |
Buchanan, Ingersoll & Rooney PC |
主权项 |
1. A tin-silver-copper solder alloy consisting of:
tin, silver, copper, bismuth, nickel, and cobalt, wherein relative to the total amount of the solder alloy, the silver content is above 2 mass % and 4 mass % or less, the copper content is 0.1 mass % or more and 1 mass % or less, the bismuth content is 0.5 mass % or more and 4.8 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, the cobalt content is 0.001 mass % or more and 0.008 mass % or less, and the tin content is the remaining content. |
地址 |
Hyogo JP |