| 摘要 |
PROBLEM TO BE SOLVED: To lighten the limitation on the layout of an element made on a semiconductor device, by putting the section where first and second patterns connect with each other in nonlinear form. SOLUTION: In the two reticles for forming the wiring the right and left of the circuit divided to right and left by a tooth-shaped boundary, the wiring patterns 150a-153a are patterns to expose the wiring on the semiconductor substrate. Patterns 150b-153b for compensation of alignment errors are ones for preventing the wiring from breaking by the error in piling up caused when connecting and exposing the right and left reticles 141 and 142, or the width of the wiring from becoming thin by double exposure. Then, an exposure band 155 is a region for deciding the contour of the periphery of the semiconductor device made by exposure. Hereby, the limitation on the layout of the element in the connection part is lightened, so the semiconductor device can be downsized more. |
