| 摘要 |
PURPOSE:To prevent the contamination of a wafer due to the adhesion of a foreign matter by forming an inclined plane brought into surface-contact with the taper of the peripheral section of the wafer and receiving the wafer to the support section of the wafer and shaping a groove for providing relief to the sharp edge of the peripheral section of the wafer. CONSTITUTION:When wafers are housed in a wafer carrier 10, the wafers 1 are inserted between guides 13, 13 and brought down. The wafers 1 are lowered along guides 13, and guided by the tooth crests 16-1 of grooves 16 and brought down gradually, the tapers 1-1 of the peripheral sections of the wafers 1 are slid along the inclined planes 16-2 of the grooves 16, the wafers 1 are balanced when the tapers 1-1 of the peripheral sections of the wafers 1 are brought into surface-contact with and made to collide with the inclined planes 16-2 of both sides of the grooves 16, and the wafers 1 are fixed into the grooves 16. The sharp edges 1-2 of the peripheral sections of the wafers 1 at that time are introduced into relief grooves 17, and are not brought into contact with the constitutional members of the wafer carrier 10. |
