发明名称 |
Adhesive lamination useful in making circuit board structures |
摘要 |
An adhesive lamination has patches of an adhesive layer which correspond to predetermined positions on a plurality of circuit boards, and the adhesive layer is applied across the plurality of circuit boards. This adhesive lamination is composed of a first separation sheet, a second separation sheet and the adhesive layer interposed between the first and second separation sheets. A number of patches of the adhesive layer are formed on the first separation sheet and arranged so that the length of the patch of the adhesive layer is approximately parallel to the short side of the first separation sheet.
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申请公布号 |
US6475314(B1) |
申请公布日期 |
2002.11.05 |
申请号 |
US19960740645 |
申请日期 |
1996.10.31 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
YOSHIHIRO SHIRAI;SHINICHI TANI |
分类号 |
G02F1/1345;B32B7/14;C09J7/02;G09F9/00;H05K3/00;H05K3/30;H05K3/36;(IPC1-7):B32B7/14 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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