发明名称 THERMAL TRANSCRIPTION DRIVEN VACUUM-PUMP
摘要 PROBLEM TO BE SOLVED: To achieve a practicable thermal transition driven vacuum-pump wherein prime-mechanisms of the pump are built up in a 3-D structure. SOLUTION: Two connectors 7 are placed up and down a capillary aggregate 4 and a support body 5 arranged respectively in planar states to build up the prime-mechanisms of the pump in a 3-D structure. Connectors in the preceding and following stages are connected through a through-window 6 provided in the support body 5, and thus the thermal transition driven vacuum-pump in a multistage cascade connection is comparatively easily realized. The capillary aggregate 4 is formed of macro-porous silicon subjected to anodic-oxidation treatment, and provided with vertically penetrated pores or small interstices in a uniform Knudsen number. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008223694(A) 申请公布日期 2008.09.25
申请号 JP20070065832 申请日期 2007.03.14
申请人 RICOH CO LTD 发明人 SANO YUTAKA
分类号 F04B37/00;F04B37/06 主分类号 F04B37/00
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