| 摘要 |
The present invention relates to a method for treating seeds (7) or for planting seeds and/or plantable material in a substrate (1) having at least one planting position. The method comprises treating the seeds (7) and/or planting material with a treatment substance (6) by depositing the treatment substance (6) at the planting position. The method further comprises depositing the seeds (7) and/or the plantable material at the planting position. The method further comprises also providing depositing means (4, 5) for depositing the treatment substance (6) and/or the seeds and/or the plantable material. The method further comprises also displacing the substrate (1) and the depositing means (4, 5) relative to one another. The method further comprises also providing control for driving the depositing means (4, 5) to deposit sequentially specimens of the seeds (7) and/or the plantable material and/or a dosed amount of treatment substance (6) for deposition thereof at the planting position. |
