发明名称 SINGLE LAYER METAL BOND GRINDING TOOL AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To improve a holding force of diamond abrasive grains in a metal bond grinding tool formed by brazing diamond abrasive grains arranged in a single layer on a metal substrate. SOLUTION: A Cr plating layer 31 is formed on a surface of a Ni group metal substrate 11 (Step S1). The Cr plating layer 31 and the Ni group metal substrate 11 are heated at a temperature lower than a melting point of the Ni group metal substrate 11 and the Cr plating layer 31, and higher than an eutectic point to combination of respective pure components of the Ni group metal substrate 11 and the Cr plating layer 31, for example, by the predetermined temperature to produce counter diffusion of a metal element on an interface between the Ni group metal substrate 11 and Cr plating layer 31 (Step S2). An eutectic composition is generated in the diffusion layer 32 (Step S3) to produce a liquid phase of the eutectic composition (Step S4). A liquid phase width is enlarged to melt the Cr plating layer 31 (Step S5). The whole layers are solidified to complete blazing.
申请公布号 JP2002154059(A) 申请公布日期 2002.05.28
申请号 JP20000347985 申请日期 2000.11.15
申请人 MITSUBISHI MATERIALS CORP 发明人 TAKAHASHI TSUTOMU
分类号 B24D3/06;B24D3/00;(IPC1-7):B24D3/06 主分类号 B24D3/06
代理机构 代理人
主权项
地址