发明名称 THERMAL HEAD
摘要 <p>PURPOSE:To enhance the life and reliability of a thermal head, by forming an upper conductive layer comprising a solderable metal film on a main conductor and providing an adhesive layer comprising the same metal as the main conductor on said upper conductive layer. CONSTITUTION:A glaze layer 12 is formed on an insulating substrate 11 and a heat generating resistor layer 13 comprising Ta2N is formed on said layer 12. Further, a current supply conductive layer A, which is formed by successively laminating a main conductive layer comprising Al, an Ni-layer 19 and an adhesive layer 20 comprising Al, is formed on said heat generating resistor layer 13. An oxidation inhibiting layer 16 comprising SiO2 and an anti-wear layer 17 comprising Ta2O5 are formed these layers and the adhesive layer 20 is removed from a terminal part and a solder layer 21 is formed on the Ni-layer 19. Because the uppermost layer of the current supply conductive layer A is the adhesive layer 20 comprising Al in this thermal head, the adhesiveness with the oxidation inhibiting layer 16 is improved.</p>
申请公布号 JPS60260354(A) 申请公布日期 1985.12.23
申请号 JP19840117794 申请日期 1984.06.08
申请人 ALPS DENKI KK 发明人 TSUSHIMA NOBORU;SHIRAKAWA KIYOUJI
分类号 H01C7/00;B41J2/335;H01L49/00;H01L49/02 主分类号 H01C7/00
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