| 摘要 |
An apparatus to permit the removal of soldered components from a mounting surface. A molten solder bath is employed to heat the securing solder to its melting point. A spring loaded gripper device holds the component during the heating operation. When the securing solder becomes liquid the component is lifted from the mounting surface by the gripper device. During this removal process a vacuum is applied to the mounting area to remove the liquid solder from the mounting holes and the surrounding surface.
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