发明名称 |
TRIMMING METHOD AND DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To quickly and highly accurately trim a part to be trimmed, while measuring the characteristics of a trimming component or a circuit board packaging the trimming component. SOLUTION: This trimming method for trimming a part 1 to be trimmed by a laser beam trims the part 1 by the use of a laser beam set up to a beam diameter H1, when a difference between a measured value obtained during the execution of trimming and an objective value is large, and when the difference between the measured value and the objective value becomes small during the execution of trimming, changes the beam dimater of a laser beam to a beam diameter H2 which is smaller than the beam diameter H1 during the execution of trimming to trim the part 1. |
申请公布号 |
JPH11238644(A) |
申请公布日期 |
1999.08.31 |
申请号 |
JP19980037863 |
申请日期 |
1998.02.20 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MORITA KEITA;KAJIWARA SHOICHI;YAMAGUCHI KAZUYOSHI |
分类号 |
H01G4/255;H01C17/22;H01G13/00;H01L21/822;H01L27/04 |
主分类号 |
H01G4/255 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|