发明名称 ADHESIVE COMPOSITION, AND CONNECTION METHOD AND CONNECTION STRUCTURE OF CIRCUIT TERMINAL USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition for electrical/electronic purposes which enables low-resistance electrical connection to be obtained and does not cause the displacement of a flexible tape or the warp of a panel; and a connection method and connection structure of circuit terminals using the same. SOLUTION: This adhesive composition essentially contains (1) a curing agent generating free radicals under heating, (2) a free-radical-polymerizable substance, (3) a film-forming material, and (4) a colorant. The connection method for circuit terminals comprises arranging a first circuit member having a first connection terminal and a second circuit member having a second connection terminal so that the first and second connection terminals face each other, causing the adhesive composition to intervene between the first and second connection terminals facing each other, and pressing the circuit members to each other while simultaneously irradiating the composition with light, thus electrically connecting the first and second connection terminals to each other.
申请公布号 JP2002201437(A) 申请公布日期 2002.07.19
申请号 JP20000399824 申请日期 2000.12.28
申请人 HITACHI CHEM CO LTD 发明人 TAKETAZU JUN;WATANABE ITSUO
分类号 G02F1/1345;C09J4/06;C09J5/00;H01L21/60;H05K3/32;H05K3/36;(IPC1-7):C09J4/06;G02F1/134 主分类号 G02F1/1345
代理机构 代理人
主权项
地址