| 摘要 |
A method for processing a substrate is provided to prevent an organic layer pattern and a substrate from being damaged by performing a half-exposure process, a melting process, a reflow process and a transformation process and by effectively and uniformly processing the substrate. An organic layer pattern(32) formed on a substrate(31) is processed by the following processes. Either of a quality changing layer(32a) or a film forming layer that is formed on the organic layer pattern is eliminated. The organic layer pattern is melted and transformed. At least a part of the elimination process is performed by supplying chemicals to the organic layer pattern.
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