Verfahren zur Verbindung einer Düsenplatte mit einem Chip

摘要

Separate adhesive is avoided in the manufacture of a thermal ink jet printhead by positioning a thermoplastic nozzle plate (1) on a semiconductor circuit chip (3) and electrically firing the ink ejection resistors (5) in a controlled amount to melt the lower surface in contact with the chip whilst not damaging the body of the nozzle plate. The resistors are fired in their intended pattern of operation during use so not to damage the resistor. Additional resistors may be added just for this bonding operation if needed with particular chip designs.