发明名称 ADHESIVE COMPOSITION, CONNECTING METHOD OF CIRCUIT TERMINAL USING THE SAME, AND CONNECTED STRUCTURE OF CIRCUIT TERMINAL
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition for electric/electronic uses, giving electric connection of low resistance for COG mounting or COF mounting and causing no short circuit, a connecting method of circuit terminals using the same and a connected structure of circuit terminals. SOLUTION: The adhesive composition interposed between circuit electrodes opposite to each other and electrically connecting electrodes in the direction of pressurization by pressurizing the circuit electrodes opposite to each other, comprises as essential ingredients (1) a curing agent generating a free radical by heating, (2) a radical-polymerizable substance, (3) a film-forming material and (4) electroconductive particles and has flowability (B)/(A) defined by using the area (A) before heating and pressurization and the area (B) after heating and pressurization, of 1.3-2.0. The connecting method of circuit terminals comprises arranging a first circuit member having a first connection terminal and a second circuit member having a second connection terminal with the first connection terminal and the second connection terminal opposite to each other, interposing the adhesive composition between the first connection terminal and the second connection terminal arranged opposite to each other, and heating and pressurizing the adhesive composition thereby electrically connecting the first connection terminal and the second connection terminal arranged opposite to each other.
申请公布号 JP2002201456(A) 申请公布日期 2002.07.19
申请号 JP20000401500 申请日期 2000.12.28
申请人 HITACHI CHEM CO LTD 发明人 TAKETAZU JUN;WATANABE ITSUO;GOTO YASUSHI;HIROZAWA YUKIHISA;FUJII MASANORI
分类号 C09J201/00;C09J4/00;C09J9/02;H01L21/60;H01L23/29;H01L23/31;H01R4/04;H05K3/32;(IPC1-7):C09J201/00 主分类号 C09J201/00
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