| 摘要 |
PROBLEM TO BE SOLVED: To accurately grind and machine an orientation flat, even if a core slides in the method, and to provide an apparatus for the orientation flat machining of an ingot. SOLUTION: In this method, the ingot I of a semiconductor single crystal, that has been ground and machined in a cylindrical shape, is ground by a whetstone 1 for machining the orientation flat. In this case, the method includes a process for fixing the ingot to a main shaft section 2; a process for measuring a diameter D of the ingot; a process for making a measuring probe 3, that can detect position coordinates with the main shaft section as a standard, to be brought into contact with the ingot fixed to the main shaft section; a process for measuring the amount of misalignment between a center shaft C1 of the ingot and a center shaft C2 of the main shaft section, based on the detected position coordinates; and a process for adjusting grinding position due to the whetstone with the main shaft section as the standard, based on the measured diameter and the amount of misalignment.
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