| 摘要 |
PURPOSE: A photosensitive resin composition is provided to ensure excellent appearance, sensitivity, and tensile elongation, thereby being suitable for a semiconductor device. CONSTITUTION: A photosensitive resin composition comprises an alkali-soluble resin, a photoresist, at least one kind compound selected from a compound represented by chemical formula(1), and solvent. The content of the compound is 0.1~50 parts by weight based on 100.0 parts by weight of alkali soluble resin. The solvent is γ-butyrolactone. The photoresist comprises a diazoquinone compound. |
