| 摘要 |
PURPOSE: A semiconductor device and a semiconductor module are provided to efficiently dissipate the heat generated by the semiconductor chip via the heat radiation electrode, the metal plate and the second supporting member. CONSTITUTION: A heat radiation electrode(15) is exposed from the back surface of an insulating resin, and a metal plate(23) is affixed to the heat radiation electrode(15). The back surface of the metal plate(23) and the back surface of a flexible sheet become substantially within a same plane, so that it is readily affixed to a second supporting member(24). In addition, the top surface of the heat radiation electrode(15) is made protrusive beyond the top surfaces of the pads(14) to reduce the distance between the semiconductor chip(16) and the heat radiation electrode(15). |
