| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a compound semiconductor wafer reduced in particle adhesion, surface oxidation, deterioration, etc., and to reduce the use of organic solvent. SOLUTION: An adsorbing pad is stuck on a grinding plate in advance, and a wafer is ground in the state of being adsorbed by the adsorbing pad without using wax and stored in pure water without being dried after then. Since the wafer is stored in the pure water; particle adhesion, surface oxidation, deterioration, etc., are reduced and a high-quality wafer is obtained. In a washing process after storing under water, organic solvent washing is omitted. Thus, the use and disposal quantity of harmful organic solvent can be reduced.
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