摘要 |
<p>The data carrier (4) of a device (1) provided with a data carrier (4) includes a casing (5) which is formed by injection molding and in which there are accommodated holding means (6) for holding a chip (7) and at least one transmission coil (8), and also includes electrically conductive connection means (16) which are connected to the holding means (6) and are arranged to connect the chip terminals (9, 10) of the chip (7) to the coil terminals (11, 12) of the transmission coil (8); the holding means include a holding foil (17) and the connection means (16) are realized while utilizing a conductor frame (18) and are formed by conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31) of the conductor frame (18), parts of said conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31) being connected to the holding foil (17) in order to hold said conductor segments, the entire holding foil (17) and the parts of the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31) which are connected to the holding foil (17) being fully enclosed by the casing (5).</p> |