发明名称 |
Wire bonding apparatus and method for clamping a wire |
摘要 |
A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.
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申请公布号 |
US7481351(B2) |
申请公布日期 |
2009.01.27 |
申请号 |
US20040928402 |
申请日期 |
2004.08.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM TAE-HYUN;KO YOUN-SUNG;SUN YOUNG-KYUN;KIM DAE-SOO;OH KOOK-JIN;LEE SANG-WOO;KIM DONG-BIN |
分类号 |
B23K31/02;H01L21/60;B23K20/00;B23K37/04;H01L21/607 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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