| 摘要 |
PROBLEM TO BE SOLVED: To improve the sealing reliability, dimension accuracy and appearance of a non-contact communication medium in a structure that the IC module composed of an IC chip and an antenna coil is sealed in a base material composed of polymer material that is product such as an IC tag for which dimensions of an IC module and the product are close to each other. SOLUTION: By preliminarily working a recessed part in such a shape that the IC module can be fitted onto the base material, arranging accuracy of the IC module is improved. Also, by limiting a softening temperature of the base material, workability of the preliminary work and sealing is improved. At this time, adhesion strength of a sealing part is improved by using local thermal fusion by ultrasonic heating for sealing work and a manufacture cost is reduced by using a continuous method by a heating roll for the preliminary work of the recessed part. |
