LEAD FRAME FOR MOUNTING LED ELEMENT, LEAD FRAME WITH RESIN, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND LEAD FRAME FOR MOUNTING SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a lead frame for mounting a semiconductor element capable of preventing generation of deformation in handling.SOLUTION: A lead frame 10 for mounting an LED element comprises: a frame body region 13; and many package regions 14 arranged in the frame body region 13 in multiple rows and multiple stages. Each of the many package regions 14 includes a die pad 25 on which an LED element 21 is mounted and a lead part 26 adjacent to the die pad 25, and the package regions 14 are connected with each other via a dicing region 15. The die pad 25 in one package region 14 and the lead parts 26 in the other vertically adjacent package regions 14 are coupled with each other by an inclined reinforcement piece 51 located in the dicing region 15.SELECTED DRAWING: Figure 2