摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in adhesion to polyimide; and an insulating adhesive for polyimide having excellent adhesion to polyimide and also having excellent insulating properties and moisture resistance.SOLUTION: This epoxy resin composition includes: an epoxy resin (A); a rubber component (B) principally consisting of a maleic anhydride-modified hydrogenated styrene butadiene rubber; a polyphenylene ether (C); and at least one phosphorus compound (D) selected among from inorganic metal salts of phosphorus compounds and complexes thereof. An insulating adhesive for polyimide containing the epoxy resin composition is also provided. In the epoxy resin composition: 10-30 mass% of the component (A), 30-50 mass% of the component (B), and 30-50 mass% of the component (C) are included relative to the total amount of the components (A), (B) and (C); while 10-20 pts.mass of the component (D) is included based on 100 pts.mass of the total amount of the components (A), (B) and (C). |