发明名称 ポリイミド用絶縁接着剤
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in adhesion to polyimide; and an insulating adhesive for polyimide having excellent adhesion to polyimide and also having excellent insulating properties and moisture resistance.SOLUTION: This epoxy resin composition includes: an epoxy resin (A); a rubber component (B) principally consisting of a maleic anhydride-modified hydrogenated styrene butadiene rubber; a polyphenylene ether (C); and at least one phosphorus compound (D) selected among from inorganic metal salts of phosphorus compounds and complexes thereof. An insulating adhesive for polyimide containing the epoxy resin composition is also provided. In the epoxy resin composition: 10-30 mass% of the component (A), 30-50 mass% of the component (B), and 30-50 mass% of the component (C) are included relative to the total amount of the components (A), (B) and (C); while 10-20 pts.mass of the component (D) is included based on 100 pts.mass of the total amount of the components (A), (B) and (C).
申请公布号 JP5943461(B2) 申请公布日期 2016.07.05
申请号 JP20120034957 申请日期 2012.02.21
申请人 株式会社ADEKA 发明人 森 貴裕;藤井 飛鳥;大津 猛
分类号 C09J163/00;C08G59/20;C08G59/68;C08K3/32;C08K5/5313;C08K5/5317;C08L15/00;C08L63/00;C09J109/06 主分类号 C09J163/00
代理机构 代理人
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