| 摘要 |
<p>A multi-level circuit board for efficiently routing electrical signals is disclosed. The circuit board includes a contact layer comprising a first substrate and formed with a set of contact pads disposed across a relatively large surface area. The contact layer also includes a set of engagement contacts corresponding to the contact pads and arrayed in a densely packed surface area. A plurality of subsequent layers are disposed in fixed stacked relationship to the contact layer. Each subsequent layer includes a subsequent substrate, and a conductive pattern formed on the subsequent substrate and defining a plurality of signal paths. Conductive vias are coupled to the contact pads and the engagement contacts and are formed through the contact layer and one or more of the plurality of subsequent layers. The vias communicate with the respective signal paths and include selected sets of staggered vias configured to optimize the routing of the signal paths along the respective subsequent layers.</p> |
