| 主权项 |
1. A semiconductor device, comprising:
a first leadframe; a second leadframe provided to be separated from the first leadframe; a semiconductor chip provided on the first leadframe, the semiconductor chip including a semiconductor layer, a first electrode, and a second electrode, the semiconductor layer having a first surface and a second surface opposite to the first surface, the first electrode being provided on the first surface and bonded to the first leadframe, the second electrode being provided on the second surface; a resin sealing the semiconductor chip; and a connector including
a first portion provided on the second surface of the semiconductor chip and bonded to the second electrode, the first portion having a bonding surface, an upper surface, and a side surface, the bonding surface being bonded to the second electrode of the semiconductor chip, the upper surface being opposite to the bonding surface and exposed from the resin, the side surface being tilted with respect to the bonding surface and the upper surface, and covered with the resin, and a second portion protruding from the first portion toward the second leadframe side, the second portion being thinner than the first portion and bonded to the second leadframe, wherein an obtuse angle is formed between the upper surface and the side surface being tilted. |
