| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tackifier and tackifying sheet that can temporarily fix an electronic member or an optical member in a removable manner and have solved those problems of the conventional heating release type tackifier and tackifying sheet, for example, the problem of easily breaking adherend at the time of removal when a large board of optical glass or thin silicon wafer is to be used as an adherend to be fixed temporarily, or the problem of greatly being reduced in removability of minute chips in the production process of a chip-like electronic member, and to prevent decrease in manufacturing yield associated with removability when the conventional technology is used. <P>SOLUTION: The removability can be greatly improved by blending a thermally expansive sphere and a component which releases water molecules by heating, with a tackifier. <P>COPYRIGHT: (C)2007,JPO&INPIT |
