| 摘要 |
The present invention relates to an apparatus for treating a wafer. The apparatus for treating a wafer includes: a wafer holder installed to be rotated while holding a wafer; a circular cover formed to enclose the circumference of the wafer holder; and a ring-shaped outlet formed in a lower side of the wafer holder. A flux is smoothly discharged toward the lower side of the wafer holder rotating at a high speed through the ring-shaped outlet, thereby improving washing dry efficiency. |
