| 摘要 |
A segmented polishing pad for use in the chemical-mechanical polishing of workpieces is presented which preferably comprises a plurality of pie-shaped segments (159). The plurality of individual pie-shaped segments (158) may also have channels (164) located between them. The segmented polishing pad (156) provides for easier storage, application, removal, and disposal of the polishing pad. The channels (164) located between the individual segments (158) may also improve the planarity of the workpieces being polished by improving the distribution of slurry used in the chemical-mechanical polishing process.
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