| 摘要 |
PROBLEM TO BE SOLVED: To enhance image position detection accuracy of an imaging device by convenient configuration, in a bonding device.SOLUTION: A mounting device includes a bonding stage 83 for heating a substrate (lead frame) 61 mounted on the upper surface thereof or a semiconductor die 63 attached to the substrate (lead frame) 61, an imaging device 20 arranged above the bonding stage 83, and capturing the image of the substrate 61 mounted on the bonding stage 83, or the semiconductor die 63 attached to the substrate 61, and a standing wave generation device 35 for generating a standing wave in a space between the upper surface of bonding stage 83 and the imaging device 20.SELECTED DRAWING: Figure 1 |
