| 摘要 |
PROBLEM TO BE SOLVED: To provide a porous para-oriented aromatic polyamide film that has high mechanical strength, uniform texture, light weight and is reinforced with short-cut fibers or pulp of low linear thermal expansion coefficient, the prepreg that is prepared by impregnating the aromatic polyamide film with a thermoplastic resin and/or a thermosetting resin, a base material for printed circuits using the prepreg and laminated sheets. SOLUTION: In the porous para-oriented aromatic polyamide film containing short-cut fibers and/or pulp, the short-cut fibers and/or pulp do not fuse at a temperature lower than 230 deg.C and the short-cut fibers has the aspect ratio of the short-cut fibers of >=50, the linear thermal expansion coefficient in the range of±50×10<-6> / deg.C and distribute in the film in parallel arrangement to the film face. In the meantime the pulp distributes in the film with uniform dispersion structure. The prepreg is given by impregnating the film with a resin and the base material for printed circuits and laminated sheets are prepared by using the prepreg. |
