发明名称 |
Struktur für Hochfrequenzoszillatoren |
摘要 |
A modular high-frequency oscillator structure utilizes a master circuit board to form a plurality of oscillator units. The master circuit board has an upper, middle and lower copper foil layer. The upper copper foil layer has a plurality of component circuit patterns and a plurality of positive voltage, ground and signal regulation circuit patterns. The middle copper foil layer has a plurality of power transfer and ground transfer circuit patterns. The lower copper foil layer has a large common ground circuit pattern. The master circuit board is etched in such a manner that the upper and lower copper foil layers are cut through to isolate each oscillator unit and the middle copper foil layer remains uncut. |
申请公布号 |
DE29900457(U1) |
申请公布日期 |
1999.06.10 |
申请号 |
DE1999200457U |
申请日期 |
1999.01.14 |
申请人 |
CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, LUNG-TAN, TW |
发明人 |
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分类号 |
H05K1/00;H05K1/02;H05K3/00;(IPC1-7):H05K1/16;H03B1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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