发明名称 Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards
摘要 A photosensitive resin composition developable with water or a diluted alkali solution comprises the following components (A) to (D). That is, the component (A) is a water-soluble photosensitive resin selected from the group consisting of a first resin obtained by introducing a styryl pyridinium group into a polyvinyl alcohol polymer, a second resin obtained by introducing a styryl quinolinium group into the polyvinyl alcohol polymer, and a third resin obtained by adding N-alkylol(meth)acrylamide to the polyvinyl alcohol polymer. The component (B) is a photosensitive prepolymer having a carboxyl group and at least two ethylenically unsaturated groups in molecule. The component (C) is a photopolymerization initiator. The component (D) is water. The photosensitive resin composition will be preferably used as a photoresist ink for manufacturing printed wiring boards.
申请公布号 US6475702(B2) 申请公布日期 2002.11.05
申请号 US20010928307 申请日期 2001.08.14
申请人 GOO CHEMICAL CO., LTD. 发明人 MORIGAKI TOSHIO
分类号 H05K3/28;C08F2/46;C08F2/50;C09D11/10;G03F7/027;G03F7/033;G03F7/038;H05K3/06;H05K3/18;(IPC1-7):G03C1/73;C08K2/46;C08J3/28 主分类号 H05K3/28
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